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Patent Searching and Data


Title:
POLISHING HEAD AND METHOD FOR MANUFACTURING POLISHING HEAD
Document Type and Number:
WIPO Patent Application WO/2019/058871
Kind Code:
A1
Abstract:
The present invention provides a polishing head for performing polishing by holding a rear surface of a workpiece and bringing a top surface of the workpiece into sliding contact with a polishing cloth affixed to a platen, characterized in that: the polishing head is provided with a head body and a template which holds the workpiece when the workpiece is being polished; the template is bonded to a lower surface peripheral edge portion of the head body with an adhesive interposed therebetween; and the surface of the head body that is bonded to the template is roughened. By this means, the present invention provides a polishing head with which it is possible to reduce differential interference contrast (DIC) toward the end of the template life.

Inventors:
DENDA Hiroki (1393, Oaza Yashir, Chikuma-shi Nagano 55, 〒3878555, JP)
KOBAYASHI Yoshikazu (1393, Oaza Yashir, Chikuma-shi Nagano 55, 〒3878555, JP)
KAWAURA Yuji (2174-1, Hodota-mach, Takasaki-shi Gunma 33, 〒3703533, JP)
ENOMOTO Tatsuo (Shin-Etsu Handotai Co. Ltd., 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo 04, 〒1000004, JP)
Application Number:
JP2018/031333
Publication Date:
March 28, 2019
Filing Date:
August 24, 2018
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO.,LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
B24B37/30; B24B41/06; H01L21/304
Foreign References:
JP2001287157A2001-10-16
JP2006128271A2006-05-18
JP2014233815A2014-12-15
JPH0251057U1990-04-10
JPS6310057U1988-01-22
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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