Title:
POLISHING HEAD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/130783
Kind Code:
A1
Abstract:
The present invention achieves a polishing head with which it is possible to evenly polish the height of a wiring pattern for each of a plurality of wiring units formed on a substrate. This polishing head 302 for retaining a substrate WF on which a plurality of wiring units PU-1 to PU-10 are formed includes: a rotating shaft 18; a base member 2 linked to the rotating shaft 18; a plurality of porous members 30-1 to 30-10 that retain a reverse surface of the substrate WF on which none of the plurality of wiring units PU-1 to PU-10 are formed; and an elastic film 4 that is disposed between the base member 2 and the plurality of wiring units PU-1 to PU-10 and that is configured so as to form a pressurized space in communication with a supply source of a fluid for pressurizing the substrate.
Inventors:
ISHII YU (JP)
Application Number:
PCT/JP2021/039071
Publication Date:
June 23, 2022
Filing Date:
October 22, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/30; B24B37/10; B24B37/12; H01L21/304
Foreign References:
| JP2017064894A | 2017-04-06 | |||
| JPH09155721A | 1997-06-17 | |||
| JP2000153449A | 2000-06-06 | |||
| JP2015039742A | 2015-03-02 | |||
| JP2002079454A | 2002-03-19 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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