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Patent Searching and Data


Title:
POLISHING LIQUID AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/208667
Kind Code:
A1
Abstract:
The present invention addresses the issue of providing a polishing liquid whereby abrasive grains in the polishing liquid are unlikely to agglomerate and, even when used in CMP, defects are less likely to occur in a polished surface. The present invention also addresses the issue of providing a chemical mechanical polishing method. This polishing liquid is used for chemical mechanical polishing and contains abrasive grains, an organic acid, and alcohol A. The alcohol A is at least one type selected from the group consisting of methanol, ethanol, 1-propanol, and isopropanol. The alcohol A content is 1.0-800 ppm by mass of the total mass of the polishing liquid.

Inventors:
KAMIMURA Tetsuya (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
Application Number:
JP2017/015979
Publication Date:
December 07, 2017
Filing Date:
April 21, 2017
Export Citation:
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Assignee:
FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (Yusen Iwamoto-cho Bldg. 6F, 3-3 Iwamoto-cho 2-chome, Chiyoda-k, Tokyo 32, 〒1010032, JP)
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