Title:
POLISHING LIQUID AND CHEMICAL-MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/221660
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing liquid with which it is possible to give an object to be polished excellent in-plane uniformity. The present invention also addresses the problem of providing a chemical-mechanical polishing method using the polishing liquid. This polishing liquid is a polishing liquid used in chemical-mechanical polishing that contains abrasive grains, an organic acid, and a water-soluble polymer and fulfills all of formulas (1)-(3). Formula (1): 1.5 ≤ η1000 rpm/η1000 rpm ≤ 20.
Formula (2): 1.2 ≤ η100 rpm/η500 rpm ≤ 10.
Formula (3): η100 rpm/η1000 rpm> η100 rpm/η500 rpm.
In formulas (1)-(3), η100 rpm is the viscosity of the polishing liquid measured at 100 rpm by a rotational viscometer at 40% RH, 23°C, η500 rpm is the viscosity of the polishing liquid measured at 500 rpm by a rotational viscometer at 40% RH, 23°C, and η1000 rpm is the viscosity of the polishing liquid measured at 1000 rpm by a rotational viscometer at 40% RH, 23°C.
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Inventors:
KAMIMURA TETSUYA (JP)
Application Number:
PCT/JP2017/020409
Publication Date:
December 28, 2017
Filing Date:
June 01, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
| JP2010028081A | 2010-02-04 | |||
| JP2009105455A | 2009-05-14 | |||
| JP2008539581A | 2008-11-13 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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