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Patent Searching and Data


Title:
POLISHING LIQUID AND CHEMICAL-MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255616
Kind Code:
A1
Abstract:
The present invention provides a polishing liquid that has good polishing speed and is capable of suppressing the occurrence of corrosion and scratches on the polishing surface, when applied to CMP of a body to be polished that has a cobalt-containing film. The present invention also provides a chemical-mechanical polishing method using the polishing liquid. This polishing liquid is used for chemical-mechanical polishing of the body to be polished having a cobalt-containing film, contains a colloidal silica, a passive film-forming agent having a ClogP value of 1.5–3.8, a polymer compound, and hydrogen peroxide, and has a pH of 2.0–4.0.

Inventors:
KAMIMURA TETSUYA (JP)
Application Number:
JP2020/020087
Publication Date:
December 24, 2020
Filing Date:
May 21, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14; H01L21/304
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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