Title:
POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/182756
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to a polishing liquid for CMP containing cerium oxide particles and water, wherein the polishing liquid for CMP has a half-value width of the main peak appearing in the 2θ = 27.000-29.980º range on the powder x-ray diffraction chart of these cerium oxide particles of 0.26-0.36º, the average particle size of these cerium oxide particles is from 130 nm to less than 175 nm, and the number of cerium oxide particles having a size of 1.15 μm or greater is 5000×103/mL or less.
Inventors:
YOSHIKAWA SHIGERU (JP)
OOTA MUNEHIRO (JP)
TANAKA TAKAAKI (JP)
SHINODA TAKASHI (JP)
OOTA MUNEHIRO (JP)
TANAKA TAKAAKI (JP)
SHINODA TAKASHI (JP)
Application Number:
PCT/JP2015/065602
Publication Date:
December 03, 2015
Filing Date:
May 29, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; C01F17/235; H01L21/304
Foreign References:
| JP2009280480A | 2009-12-03 | |||
| JP2011104680A | 2011-06-02 | |||
| JP2008270341A | 2008-11-06 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
Hidekazu Miyoshi (JP)
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