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Patent Searching and Data


Title:
POLISHING LIQUID COMPOSITION FOR SILICON OXIDE FILM
Document Type and Number:
WIPO Patent Application WO/2020/262234
Kind Code:
A1
Abstract:
In an aspect, provided is a polishing liquid composition capable of improving polishing selectivity while ensuring the polishing speed of a silicon oxide film. An aspect of the present disclosure pertains to a polishing liquid composition which is for a silicon oxide film and contains cerium oxide particles (component A), a water-soluble polymer (component B), an anionic condensate (component C), and an aqueous medium, wherein the component B is a polymer containing a structural unit b1 represented by formula (I).

Inventors:
SUGAHARA MASATO
YAMAGUCHI NORIHITO
KUDO KOKI
Application Number:
JP2020/024130
Publication Date:
December 30, 2020
Filing Date:
June 19, 2020
Export Citation:
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Assignee:
KAO CORP (JP)
International Classes:
C09G1/02; B24B37/00; C09K3/14; H01L21/304
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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