Title:
POLISHING LIQUID COMPOSITION FOR SILICON SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/074831
Kind Code:
A1
Abstract:
One aspect provides a polishing liquid composition which is for a silicon substrate and with which improvements in the polishing speed and storage stability of a concentrate can both be achieved. In one aspect, the present disclosure pertains to a polishing liquid composition for a silicon substrate, the polishing liquid composition containing the following component A and the following component B and having a pH of 8.5-14 (exclusive of 8.5). The component A is silica particles. The component B is an amino group-containing water‐soluble polymer having a pKa of 5-8.5.
Inventors:
MIURA JOJI
WAKABAYASHI KEISUKE
WAKABAYASHI KEISUKE
Application Number:
PCT/JP2020/038324
Publication Date:
April 14, 2022
Filing Date:
October 09, 2020
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2013084686A1 | 2013-06-13 | |||
| WO2016143323A1 | 2016-09-15 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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