Title:
POLISHING LIQUID COMPOSITION FOR SILICON WAFERS
Document Type and Number:
WIPO Patent Application WO/2011/004793
Kind Code:
A1
Abstract:
Disclosed is a polishing liquid composition for silicon wafers, which comprises an abrasive material, an aqueous medium, and a polymer compound. The polymer compound has structural unit (a1) represented by general formula (1), structural unit (a2) represented by general formula (2), and structural unit (a3) represented by general formula (3), wherein the total amount of the structural units (a3) constitutes 0.001 to 1.5 mol% of all the structural units of the polymer compound.
Inventors:
SUZUKI Masahiko (())
鈴木眞彦 (())
OKAMURA Mami (())
鈴木眞彦 (())
OKAMURA Mami (())
Application Number:
JP2010/061411
Publication Date:
January 13, 2011
Filing Date:
July 05, 2010
Export Citation:
Assignee:
KAO CORPORATION (14-10, Nihonbashi Kayabacho 1-chome Chuo-k, Tokyo 10, 〒1038210, JP)
花王株式会社 (〒10 東京都中央区日本橋茅場町一丁目１４番１０号 Tokyo, 〒1038210, JP)
SUZUKI Masahiko (())
鈴木眞彦 (())
花王株式会社 (〒10 東京都中央区日本橋茅場町一丁目１４番１０号 Tokyo, 〒1038210, JP)
SUZUKI Masahiko (())
鈴木眞彦 (())
International Classes:
H01L21/304; B24B37/00
Attorney, Agent or Firm:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS (26th Floor, OAP TOWER 8-30, Tenmabashi 1-chome, Kita-ku, Osaka-sh, Osaka 26, 〒5306026, JP)
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