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Patent Searching and Data


Title:
POLISHING LIQUID, METHOD FOR MANUFACTURING GLASS SUBSTRATE, AND METHOD FOR MANUFACTURING MAGNETIC DISK
Document Type and Number:
WIPO Patent Application WO/2019/088209
Kind Code:
A1
Abstract:
According to the present invention, in a particle size distribution for a cerium oxide contained in a polishing liquid as obtained by a laser diffraction/scattering method, D5 is 1 μm or less, and the difference between D95 and D5 is 3 μm or more, assuming that a particle size is Dx[μm], when the cumulative particle volume cumulated from a small particle diameter side reaches x[%] of the total particle volume.

Inventors:
TAKIZAWA, Toshio (6-10-1 Nishi-Shinjuku Shinjuku-k, Tokyo 47, 〒1608347, JP)
Application Number:
JP2018/040610
Publication Date:
May 09, 2019
Filing Date:
October 31, 2018
Export Citation:
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Assignee:
HOYA CORPORATION (6-10-1 Nishi-Shinjuku, Shinjuku-ku Tokyo, 47, 〒1608347, JP)
International Classes:
C09K3/14; B24B1/00; B24B9/00; B24B37/00; G11B5/84
Domestic Patent References:
WO2013069720A12013-05-16
WO2016002825A12016-01-07
Foreign References:
JP2014197449A2014-10-16
JP2012020377A2012-02-02
JP2002371267A2002-12-26
JP2008284679A2008-11-27
JP2002301655A2002-10-15
JP2002180034A2002-06-26
Attorney, Agent or Firm:
GLOBAL IP TOKYO (CARMEL II, 8-3-30 Nishi-Shinjuku, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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