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Patent Searching and Data


Title:
POLISHING LIQUID AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/116521
Kind Code:
A1
Abstract:
A polishing liquid of the present invention comprises manganese oxide grindstone particles, permanganate ions, and a cellulose-based surfactant or a cationic surfactant, and has a pH of 5 to 11. The cellulose-based surfactant is preferably carboxy methyl cellulose or a derivative thereof. It is also preferable that the cationic surfactant has a quaternary ammonium ion site. It is also preferable that the concentration of the cellulose-based surfactant or cationic surfactant is 0.01 to 1.0 mass% with respect to the total amount of the polishing liquid.

Inventors:
MATSUO KEN (JP)
MATSUYAMA MASAYUKI (JP)
HORIUCHI MIKIMASA (JP)
KUMAGAI AKINORI (JP)
Application Number:
JP2017/029370
Publication Date:
June 28, 2018
Filing Date:
August 15, 2017
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
WO2016158328A12016-10-06
WO2013054883A12013-04-18
Foreign References:
JP2012248569A2012-12-13
JP2015005702A2015-01-08
US20160133465A12016-05-12
JP2015229748A2015-12-21
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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