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Title:
POLISHING LIQUID AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/147074
Kind Code:
A1
Abstract:
Provided is a polishing liquid which is used to polish a surface-to-be-polished that contains a tungsten material, wherein: the polishing liquid contains abrasive grains, a polymer having cationic groups at terminals, an oxidizing agent, a metal oxide-solubilizing agent and water; the polymer has structural units derived from an unsaturated carboxylic acid and has a weight average molecular weight of 20,000 or less; and the polishing liquid has a pH of less than 5.0.

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Inventors:
ONO HIROSHI (JP)
MIZUTANI MAKOTO (JP)
Application Number:
PCT/JP2018/001981
Publication Date:
August 16, 2018
Filing Date:
January 23, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Foreign References:
JP2000315667A2000-11-14
JP2010518601A2010-05-27
US4944836A1990-07-31
JP3822339B22006-09-20
JP2010258416A2010-11-11
Other References:
See also references of EP 3582252A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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