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Title:
POLISHING LIQUID AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/193693
Kind Code:
A1
Abstract:
A polishing liquid that is used to polish silicon nitride, the polishing liquid comprising cerium-oxide-containing abrasive grains and a liquid medium, wherein the cerium oxide contains an element that has an ionic radius greater than that of cerium.

Inventors:
YAMASHITA TAKASHI (JP)
NOMURA SATOYUKI (JP)
MINAMI HISATAKA (JP)
Application Number:
PCT/JP2018/014459
Publication Date:
October 10, 2019
Filing Date:
April 04, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
JP2015034243A2015-02-19
JP2015034244A2015-02-19
JP2015035522A2015-02-19
JP2012503880A2012-02-09
JP2011510900A2011-04-07
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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