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Title:
POLISHING LIQUID PRODUCTION METHOD, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/108113
Kind Code:
A1
Abstract:
 The present invention relates to a polishing liquid production method in which the pH of the polishing liquid is 4 or less, said method comprising: a step for obtaining a solution by dissolving a polymerization initiator in an aqueous solvent that does not contain inorganic acid; a step for obtaining a methacrylic acid polymer by at least polymerizing a monomer component that contains methacrylic acid in said solution; and a step for obtaining a polishing liquid by mixing the methacrylic acid polymer, a specific carboxylic acid compound, polishing particles, and a metal corrosion prevention agent.

Inventors:
HANANO MASAYUKI (JP)
SAKASHITA MASAHIRO (JP)
FUKASAWA MASATO (JP)
MISHIMA KOUJI (JP)
Application Number:
PCT/JP2015/050954
Publication Date:
July 23, 2015
Filing Date:
January 15, 2015
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; C08F2/10; C08F20/06; H01L21/304
Domestic Patent References:
WO2009005143A12009-01-08
WO2007116770A12007-10-18
WO2005012369A12005-02-10
Foreign References:
JP2013042123A2013-02-28
JP2012134358A2012-07-12
JP2013197526A2013-09-30
JP2009242594A2009-10-22
JPH08333420A1996-12-17
JPH10204108A1998-08-04
JPS5688407A1981-07-17
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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