Title:
POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/180887
Kind Code:
A1
Abstract:
A polishing liquid that contains abrasive grains, a hydroxy acid, a polyol, and a liquid medium. The zeta potential of the abrasive grains is positive, and the hydroxy acid has one carboxyl group and 1–3 hydroxyl groups.
Inventors:
IWANO TOMOHIRO (JP)
Application Number:
PCT/JP2018/011464
Publication Date:
September 26, 2019
Filing Date:
March 22, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; C09K3/14
Foreign References:
| JP2018044046A | 2018-03-22 | |||
| JP2015137297A | 2015-07-30 | |||
| JP2007318072A | 2007-12-06 | |||
| JP2012186339A | 2012-09-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: