Title:
POLISHING LIQUID, POLISHING LIQUID SET, AND SUBSTRATE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/043139
Kind Code:
A1
Abstract:
Provided is a polishing liquid comprising a liquid vehicle, abrasive grains, and a polymer. The polymer has a first molecular chain where functional groups are directly bonded and a second molecular chain branched from the first molecular chain. The functional groups are at least one selected from the group consisting of carboxyl, carboxylate, hydroxyl, sulfo, and sulfonate groups.
More Like This:
| JPS5851076 | METAL BONDED DIAMOND POLISHING MATERIAL BLOCK |
| WO/1994/007969 | ABRASIVE GRAIN INCLUDING RARE EARTH OXIDE THEREIN |
| WO/2001/004231 | POLISHING LIQUID COMPOSITION |
Inventors:
AKUTSU TOSHIAKI (JP)
MINAMI HISATAKA (JP)
IWANO TOMOHIRO (JP)
YAMASHITA TETSURO (JP)
AOKI MASAKO (JP)
FUKASAWA MASATO (JP)
MINAMI HISATAKA (JP)
IWANO TOMOHIRO (JP)
YAMASHITA TETSURO (JP)
AOKI MASAKO (JP)
FUKASAWA MASATO (JP)
Application Number:
PCT/JP2016/067585
Publication Date:
March 16, 2017
Filing Date:
June 13, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2009104334A1 | 2009-08-27 | |||
| WO2015008193A1 | 2015-01-22 | |||
| WO2012070541A1 | 2012-05-31 |
Foreign References:
| JP2009518852A | 2009-05-07 | |||
| JP2013507786A | 2013-03-04 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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