Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING MATERIAL AND METHOD FOR MANUFACTURING POLISHING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/123922
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polishing material whereby a polishing part can be made thicker while a reduction in polishing rate is suppressed, and a method for manufacturing a polishing material. This polishing material (1) is provided with a substrate (10) and a polishing layer (20) that includes abrasive grains (21) and a binder (22) and is layered on the surface side of the substrate (10), the polishing layer (20) having a plurality of columnar polishing parts (20a), the polishing parts (20a) including fumed silica, and the substrate (10) having a heat-resistant resin as a main component thereof.

Inventors:
NAKANE Soichiro (6-6, Minatojima-Minamimachi 4-chome, Chuo-ku, Kobe-sh, Hyogo 47, 〒6500047, JP)
IWANAGA Tomoki (6-6, Minatojima-Minamimachi 4-chome, Chuo-ku, Kobe-sh, Hyogo 47, 〒6500047, JP)
Application Number:
JP2018/042368
Publication Date:
June 27, 2019
Filing Date:
November 15, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
BANDO CHEMICAL INDUSTRIES, LTD. (6-6 Minatojima-Minamimachi 4-chome, Chuo-ku Kobe-sh, Hyogo 47, 〒6500047, JP)
International Classes:
B24D11/00; B24D3/00
Domestic Patent References:
WO2016067857A12016-05-06
Foreign References:
JP2016536152A2016-11-24
JP2002337053A2002-11-26
JP2003534137A2003-11-18
JP2005533670A2005-11-10
Attorney, Agent or Firm:
AMANO Kazunori (6th Floor Fujikogyo Building, 1-18, Aioi-cho 1-chome, Chuo-ku, Kobe-sh, Hyogo 25, 〒6500025, JP)
Download PDF: