POLISHING MATERIAL AND PROCESS FOR PRODUCING POLISHING MATERIAL

WIPO Patent Application WO/2016/067857

A1

The purpose of the present invention is to provide a polishing material with which both the efficiency of working of a substrate material and the finish flatness can be attained on a high level at low polishing cost and with which even a substrate difficult to work, such as sapphire or silicon carbide, can be efficiently and precisely polished. This polishing material comprises a base and a polishing layer formed on the front-side surface thereof, and is characterized in that the polishing layer comprises a binder comprising an inorganic substance as a main component and abrasive particles dispersed in the binder and that the polishing layer has a surface configured of a plurality of regions separated by grooves, the polishing layer surface having a maximum protrusion height (Rp) of 2.5-70 μm. It is preferable that in a plan view, at least two such regions have been disposed in each of X and Y directions perpendicular to each other. It is preferable that the binder contain a filler comprising an oxide as the main component and that the oxide filler have an average particle diameter smaller than the average particle diameter of the abrasive particles. It is preferable that the inorganic substance be a silicic acid salt. It is preferably that the abrasive particles be diamond.

MUKAI FUMIHIRO (JP)
IWANAGA TOMOKI (JP)
TAKAGI DAISUKE (JP)
SAITO KAZUO (JP)
TAURA TOSHIKAZU (JP)

PCT/JP2015/078401

May 06, 2016

October 06, 2015

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BANDO CHEMICAL IND (JP)

B24D11/00; B24D3/00; B24D3/04

JP2009072832A	2009-04-09
JPH05111878A	1993-05-07
JPS57114367A	1982-07-16
JP2009511281A	2009-03-19
JP2010179402A	2010-08-19

AMANO KAZUNORI (JP)
Kazuki Amano (JP)

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