POLISHING MATERIAL

WIPO Patent Application WO/2017/163565

A1

The purpose of the present invention is to provide a polishing material which is not susceptible to decrease of the polishing rate over a relatively long period of time. The present invention is a polishing material which comprises a base sheet and a polishing layer that is laminated on the front surface of the base sheet and contains abrasive grains and a binder, and which is characterized in that: the polishing layer comprises a plurality of kinds of abrasive grains; and if first abrasive grains are a kind of abrasive grains having the largest grain diameter among the plurality of kinds of abrasive grains and second abrasive grains are a kind of abrasive grains having the second largest grain diameter among the plurality of kinds of abrasive grains, the ratio of the average grain diameter of the second abrasive grains to the average grain diameter of the first abrasive grains is from 5% to 70% (inclusive). It is preferable that the total content of the abrasive grains in the polishing layer is from 50% by volume to 85% by volume (inclusive). It is preferable that the content of the first abrasive grains in the polishing layer is from 1% by volume to 25% by volume (inclusive). It is preferable that the first abrasive grains are diamond abrasive grains and the second abrasive grains are alumina abrasive grains.

TAKAGI DAISUKE (JP)
IWANAGA TOMOKI (JP)
SAITO KAZUO (JP)
TAURA TOSHIKAZU (JP)

PCT/JP2017/001708

September 28, 2017

January 19, 2017

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BANDO CHEMICAL IND (JP)

B24D3/00; B24D11/00

JPH04250979A	1992-09-07
JP2001516652A	2001-10-02
JPH0639736A	1994-02-15
JPH0373275A	1991-03-28

AMANO Kazunori (JP)

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