Title:
POLISHING MEASUREMENT DEVICE AND ABRASION TIME CONTROLLING METHOD THEREOF, AND POLISHING CONTROL SYSTEM INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2018/026075
Kind Code:
A1
Abstract:
The present embodiments provides a mechanism in which the thickness of a scanned wafer shape is calculated to determine a profile, and a calculated PV value and a set predictive PV value for each profile are used such that a delta correction value and an abrasion endpoint time are calculated and then applied to an abrasion time of each wafer which is being abraded. Therefore, the present embodiments achieve excellent planarization of wafer surfaces, and simultaneously control a plurality of controllers to reduce facility costs.
Inventors:
HAN KEE YUN (KR)
JUNG SUK JIN (KR)
JUNG SUK JIN (KR)
Application Number:
PCT/KR2017/000357
Publication Date:
February 08, 2018
Filing Date:
January 11, 2017
Export Citation:
Assignee:
SK SILTRON CO LTD (KR)
International Classes:
B24B49/02; B24B37/04; H01L21/304; H01L21/306
Foreign References:
| KR101141075B1 | 2012-05-03 | |||
| KR20160033033A | 2016-03-25 | |||
| KR20050002801A | 2005-01-10 | |||
| KR20150007967A | 2015-01-21 | |||
| JP2015053438A | 2015-03-19 |
Attorney, Agent or Firm:
PARK, Young Bok et al. (KR)
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