Title:
POLISHING METHOD AND POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/163164
Kind Code:
A1
Abstract:
The present invention relates to a polishing method and polishing apparatus, whereby a substrate such as a wafer is polished while a film thickness is measured on the basis of optical information included in reflected light from the substrate. The polishing method comprises preparing a plurality of spectral groups including each of a plurality of reference spectra corresponding to different film thicknesses, receiving reflected light from the substrate while radiating light to the substrate, generating a sampling spectrum from the reflected light, selecting a spectral group including a reference spectrum having a shape closest to that of the sampling spectrum, generating a measurement spectrum while polishing the substrate, selecting the reference spectrum having a shape closest to that of the measurement spectrum generated during polishing of the substrate from the selected spectral group, and acquiring the film thickness that corresponds to the selected reference spectrum.
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Inventors:
KOBAYASHI YOICHI (JP)
YAGI KEITA (JP)
KINOSHITA MASAKI (JP)
SHIOKAWA YOICHI (JP)
YAGI KEITA (JP)
KINOSHITA MASAKI (JP)
SHIOKAWA YOICHI (JP)
Application Number:
PCT/JP2015/061224
Publication Date:
October 29, 2015
Filing Date:
April 10, 2015
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/013; B24B37/34; B24B49/02; B24B49/12; H01L21/304
Foreign References:
| JP2013532912A | 2013-08-19 | |||
| JP2013222856A | 2013-10-28 | |||
| JP2013541827A | 2013-11-14 | |||
| JP2012508452A | 2012-04-05 | |||
| US20120026492A1 | 2012-02-02 |
Attorney, Agent or Firm:
WATANABE, Isamu et al. (JP)
Isamu Watanabe (JP)
Isamu Watanabe (JP)
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