Title:
POLISHING METHOD AND COMPOSITION ADJUSTING AGENT
Document Type and Number:
WIPO Patent Application WO/2016/190128
Kind Code:
A1
Abstract:
Provided is a polishing method which achieves an excellent polishing result even when a polishing composition which has been used in polishing an object to be polished is collected and reused. The polishing method according to the present invention for polishing an object to be polished using a polishing composition containing a water-soluble polymer, comprises: a polishing step for polishing the object to be polished while supplying the polishing composition in a tank (21) to the object to be polished; a collection step for collecting and returning the polishing composition which has been used in polishing the object to be polished to the tank (21) for circulation; and a composition adjusting step for adjusting the concentration of the water-soluble polymer in the polishing composition supplied to the object to be polished, to a value falling within a preset range.
Inventors:
ODA HIROYUKI (JP)
TAKAMI SHINICHIRO (JP)
TAKAHASHI SHUHEI (JP)
TABATA MAKOTO (JP)
TAKAMI SHINICHIRO (JP)
TAKAHASHI SHUHEI (JP)
TABATA MAKOTO (JP)
Application Number:
PCT/JP2016/064226
Publication Date:
December 01, 2016
Filing Date:
May 13, 2016
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
B24B57/02; B24B37/00; H01L21/304
Domestic Patent References:
| WO2012102144A1 | 2012-08-02 |
Foreign References:
| JP2012114225A | 2012-06-14 | |||
| JP2009054629A | 2009-03-12 | |||
| JP5843036B1 | 2016-01-13 |
Attorney, Agent or Firm:
MORI Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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