Title:
POLISHING METHOD, COMPOSITION FOR REMOVING IMPURITY, SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/208445
Kind Code:
A1
Abstract:
Provided is a polishing method with which it is possible to sufficiently remove impurities present on an object to be polished. An object to be polished that has an organic film on the surface thereof is polished using a polishing composition that contains abrasive grains, and is subsequently polished using an impurity-removing composition that contains an organic compound to eliminate impurities present on the object to be polished. The organic compound contains a surfactant and/or a water-soluble polymer. The surfactant contains a hydrophilic group and a hydrophobic group that includes a C3 or higher hydrocarbon group, and the main chain of the water-soluble polymer is hydrophobic.
Inventors:
ISHIDA YASUTO (JP)
Application Number:
PCT/JP2016/067570
Publication Date:
December 29, 2016
Filing Date:
June 13, 2016
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/04
Foreign References:
| JP2005268409A | 2005-09-29 | |||
| JP2007150184A | 2007-06-14 | |||
| JP2008543060A | 2008-11-27 |
Attorney, Agent or Firm:
MORI Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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