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Title:
POLISHING METHOD, POLISHING DEVICE, AND RECORDING MEDIUM WITH COMPUTER PROGRAM RECORDED THEREON
Document Type and Number:
WIPO Patent Application WO/2018/034308
Kind Code:
A1
Abstract:
The present invention relates to a polishing method for polishing a substrate such as a wafer. The polishing method comprises: polishing a substrate (W) by pressing the substrate (W) against the surface of a polishing pad (3); changing the surface temperature of the polishing pad (3) by operating flow rate control valves (42, 56) that are for controlling the flow rate of a fluid flowing through a pad temperature adjusting member (11) during the polishing of the substrate (W); measuring the surface temperature of the polishing pad (3); computing a PID parameter on the basis of a change in the surface temperature of the polishing pad (3) over time; calculating operation quantities of the flow rate control valves (42, 56) that are for minimizing the deviation between a target temperature value and a measured value of the surface temperature of the polishing pad by using a PID arithmetic expression that includes the PID parameter; and operating the flow rate control valves (42, 56) in accordance with the operation quantities during the polishing of the substrate (W).

Inventors:
KABASAWA, Masashi (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
MATSUO, Hisanori (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
Application Number:
JP2017/029453
Publication Date:
February 22, 2018
Filing Date:
August 16, 2017
Export Citation:
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Assignee:
EBARA CORPORATION (11-1, Haneda Asahi-cho Ohta-k, Tokyo 10, 〒1448510, JP)
International Classes:
B24B37/015; B24B37/34; B24B49/14; H01L21/304
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (GOWA Nishi-Shinjuku 4F, 5-8 Nishi-Shinjuku 7-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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