Title:
POLISHING METHOD, POLISHING DEVICE, AND SEMICONDUCTOR DEVICE PRODUCING METHOD
Document Type and Number:
WIPO Patent Application WO/2002/056356
Kind Code:
A1
Abstract:
A wafer (30) is polished by relatively moving a polishing body and the wafer (30) while applying a load between the polishing body and the wafer (30), with a polishing agent interposed between the polishing body and the wafer (30). A first step polishes the wafer (30) by using a hard polishing pad (42) as the polishing body while pressing the wafer (30) against the polishing pad (42) by air pressure. A second step following the first step uses a soft polishing pad as the polishing body to polish the wafer (30). This reduces erosion, dishing, etc., and provides a polished surface having few microscratches, further improving the flatness.
Inventors:
MATHUKAWA EIJI (JP)
Application Number:
PCT/JP2002/000009
Publication Date:
July 18, 2002
Filing Date:
January 07, 2002
Export Citation:
Assignee:
NIPPON KOGAKU KK (JP)
MATHUKAWA EIJI (JP)
MATHUKAWA EIJI (JP)
International Classes:
B24B37/013; B24B37/04; B24B37/20; B24B37/24; B24B37/26; B24B57/02; H01L21/304; H01L21/321; (IPC1-7): H01L21/304; B24B37/00; B24B37/04
Foreign References:
| JPH05277908A | 1993-10-26 | |||
| JPH07142432A | 1995-06-02 | |||
| JP2000233360A | 2000-08-29 | |||
| JPH10294298A | 1998-11-04 | |||
| JPH11309664A | 1999-11-09 | |||
| JPH10335288A | 1998-12-18 | |||
| JP2000164595A | 2000-06-16 |
Attorney, Agent or Firm:
Hosoe, Toshiaki (3-6 Nishikanagawa 1-Chome, Kanagawa-k, Yokohama-Shi Kanagawa, JP)
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