Title:
POLISHING METHOD AND POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/076039
Kind Code:
A1
Abstract:
A method of polishing a face to be polished while supplying a polishing agent to the face to be polished comprises a rotating step of rotating a workpiece, and a polishing step of polishing the face to be polished with a polishing tool. The face to be polished is polished, in the polishing step, by the polishing tool moving between the face to be polished and a receiving face while resupplying the polishing agent to the face to be polished by way of transporting, toward the face to be polished, the polishing agent that accumulates in the receiving face by flowing from the face to be polished to the exterior in a situation where a polishing fixture having the receiving face that receives the polishing agent in a continuous face or the exterior of the continuous face that is linked to the peripheral edge of the face to be polished.
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Inventors:
MURATA SUGURU (JP)
Application Number:
PCT/JP2014/077621
Publication Date:
May 28, 2015
Filing Date:
October 16, 2014
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B24B13/04; B24B13/005; B24B37/00; B24B37/025
Foreign References:
| JP2001054862A | 2001-02-27 | |||
| JP2008168376A | 2008-07-24 | |||
| JP2003025203A | 2003-01-29 | |||
| JP2006181665A | 2006-07-13 | |||
| JP2005161410A | 2005-06-23 | |||
| JP2008279584A | 2008-11-20 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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