POLISHING METHOD AND POLISHING FLUID

Title:

POLISHING METHOD AND POLISHING FLUID

Document Type and Number:

WIPO Patent Application WO/2003/071593

Kind Code:

A1

Abstract:

A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid which contains an anionic surfactant and no abrasive grains. The method can be advantageously employed for polishing an article to be polished, such as a semiconductor wafer, using fixed abrasive grains.

Inventors:

WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
HAGIHARA TOSHIYA (JP)

Application Number:

PCT/JP2003/001870

Publication Date:

August 28, 2003

Filing Date:

February 20, 2003

Export Citation:

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Assignee:

EBARA CORP (JP)
KAO CORP (JP)
WADA YUTAKA (JP)
AKATSUKA TOMOHIKO (JP)
SASAKI TATSUYA (JP)
HAGIHARA TOSHIYA (JP)

International Classes:

B24B7/22; B24B37/04; B24B49/12; B24B53/007; B24B53/02; C09G1/00; H01L21/304; H01L21/3105; (IPC1-7): H01L21/304; B24B37/00; C09K3/14

Domestic Patent References:

WO1998018159A1	1998-04-30
WO1997010613A1	1997-03-20

Foreign References:

JP2002043256A	2002-02-08
JP2000173955A	2000-06-23
US20020160609A1	2002-10-31

Other References: