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Patent Searching and Data


Title:
POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/057156
Kind Code:
A1
Abstract:
[Problem] The present invention provides a means that is capable of achieving sufficient planarization of the surface of an object of polishing, said object containing two or more different materials. [Solution] The present invention is a polishing method wherein an object of polishing, which contains two or more different materials, is polished with use of a polishing composition. This polishing method comprises equalization of the surface zeta potential of the object of polishing.

Inventors:
YOSHIZAKI YUKINOBU (JP)
YARITA SATORU (JP)
ONISHI SHOGO (JP)
Application Number:
JP2016/077906
Publication Date:
April 06, 2017
Filing Date:
September 21, 2016
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
WO2008004579A12008-01-10
WO2015052988A12015-04-16
Foreign References:
JP2009170935A2009-07-30
JP2013138053A2013-07-11
JP2011211178A2011-10-20
JP2010056127A2010-03-11
JP2004363611A2004-12-24
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
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