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Patent Searching and Data


Title:
POLISHING PAD, POLISHING DEVICE, POLISHING METHOD USING SAME, AND METHOD FOR MANUFACTURING POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2021/002089
Kind Code:
A1
Abstract:
The present invention provides a substantially circular polishing pad for single-sided polishing of a semiconductor silicon wafer, the polishing pad which has a circular polishing region having an outer diameter smaller than the outer diameter of the polishing pad on the surface of the polishing pad, and which is characterized in that the center of the polishing pad and the center of the circular polishing region are present at different positions. As a result, it is possible to provide a polishing pad, a polishing device, a polishing method using the same, and a method for manufacturing a polishing pad that make it possible to resolve the problem of sagging of the outer periphery of the wafer in single-sided polishing and prevent abnormal deformation of the wafer after polishing.

Inventors:
SATO Kazuya (JP)
SHIMA Sunao (JP)
OKADA Koji (JP)
Application Number:
JP2020/018228
Publication Date:
January 07, 2021
Filing Date:
April 30, 2020
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO., LTD. (JP)
NITTA DUPONT INCORPORATED (JP)
International Classes:
B24B37/20; H01L21/304
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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