POLISHING PAD, POLISHING DEVICE, POLISHING METHOD USING SAME, AND METHOD FOR MANUFACTURING POLISHING PAD

WIPO Patent Application WO/2021/002089

A1

The present invention provides a substantially circular polishing pad for single-sided polishing of a semiconductor silicon wafer, the polishing pad which has a circular polishing region having an outer diameter smaller than the outer diameter of the polishing pad on the surface of the polishing pad, and which is characterized in that the center of the polishing pad and the center of the circular polishing region are present at different positions. As a result, it is possible to provide a polishing pad, a polishing device, a polishing method using the same, and a method for manufacturing a polishing pad that make it possible to resolve the problem of sagging of the outer periphery of the wafer in single-sided polishing and prevent abnormal deformation of the wafer after polishing.

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JP4155790	Chemical mechanical polishing method and polishing pad for element miniaturization separation
WO/2002/054471	APPARATUS AND METHOD FOR ABRADING SEMICONDUCTOR WAFER

SATO KAZUYA (JP)
SHIMA SUNAO (JP)
OKADA KOJI (JP)

PCT/JP2020/018228

January 07, 2021

April 30, 2020

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SHINETSU HANDOTAI KK (JP)
NITTA DUPONT INCORPORATED (JP)

B24B37/20; H01L21/304

JP2000246627A	2000-09-12
JP2006068888A	2006-03-16

YOSHIMIYA Mikio et al. (JP)

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