POLISHING PAD AND POLISHING DEVICE

Title:

POLISHING PAD AND POLISHING DEVICE

Document Type and Number:

WIPO Patent Application WO/2000/027589

Kind Code:

A1

Abstract:

A polishing pad characterized by comprising a polishing layer having a micro-rubber A hardness of at least 80 degrees and a cushion layer having a bulk modulus of at least 40 Mpa and a tensile elastic modulus of at least 0.1 Mpa and up to 20 Mpa; and a polishing device characterized in that a semiconductor substrate is fixed to a polishing head, the above polishing pad is fixed to a polishing surface plate with the polishing layer facing the semiconductor substrate, and one or both of the polishing head and the polishing surface plate are rotated to polish the semiconductor substrate. A polishing device or a polishing pad used in a mechanical flattening process for smoothing by polishing an insulation layer formed on a semiconductor substrate or the surface of a metal wiring, wherein technologies are provided for uniformly flattening the entire surface of a semiconductor substrate and polishing it uniformly up to a portion close to a wafer edge and for making uniformity and flatness compatible with each other at a high platen rotation speed.

More Like This:

JP2993497	[Title of Invention] Polishing apparatus and polishing method
JP2008124220	POLISHING SOLUTION

Inventors:

SHIRO KUNIYASU (JP)
MINAMIGUCHI HISASHI (JP)
OKA TETSUO (JP)

Application Number:

PCT/JP1999/006179

Publication Date:

May 18, 2000

Filing Date:

November 05, 1999

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TORAY INDUSTRIES (JP)
SHIRO KUNIYASU (JP)
MINAMIGUCHI HISASHI (JP)
OKA TETSUO (JP)

International Classes:

B24B37/00; B24B37/20; B24B37/22; B24B37/24; B24D13/14; (IPC1-7): B24B37/00

Foreign References:

EP0658401A1	1995-06-21
JPH1034525A	1998-02-10
JPH08132342A	1996-05-28
JPH0950974A	1997-02-18
JPH10156724A	1998-06-16
EP0555660A2	1993-08-18

Other References: