Title:
POLISHING PAD, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISHING METHOD FOR WAFER
Document Type and Number:
WIPO Patent Application WO/2022/107468
Kind Code:
A1
Abstract:
The present invention is a polishing pad comprising a polishing layer for polishing a surface of a wafer, and a double-sided tape for attaching the polishing layer to an upper surface plate of a double-side polishing device. A 90° peeling adhesive force A of the double-sided tape is 2000 g/cm or more, and a ratio A/B between the 90° peeling adhesive force A and a 180° peeling adhesive force B is 1.05 or greater. The double-sided tape has a base material, a polishing layer side adhesive layer on a side to be attached to the polishing layer, and an upper surface plate side adhesive layer on a side to be attached to the upper surface plate. The total thickness of the polishing layer side adhesive layer and the upper surface plate side adhesive layer is 80 μｍ or less. Thus, the polishing pad capable of reducing deterioration of the flatness of a wafer when double-side polishing the wafer is provided.
Inventors:
UENO JUNICHI (JP)
Application Number:
PCT/JP2021/036752
Publication Date:
May 27, 2022
Filing Date:
October 05, 2021
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/22; B24B37/08; H01L21/304
Foreign References:
| JP2005034940A | 2005-02-10 | |||
| JP2015038174A | 2015-02-26 | |||
| JPH11503191A | 1999-03-23 | |||
| JP2015078348A | 2015-04-23 | |||
| JP2004323679A | 2004-11-18 | |||
| JP2011122069A | 2011-06-23 | |||
| JP2018107261A | 2018-07-05 | |||
| JP2004001160A | 2004-01-08 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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