Title:
POLISHING PAD AND GLASS SUBSTRATE MANUFACTURING METHOD USING SAID POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2013/046576
Kind Code:
A1
Abstract:
A polishing pad used in a glass substrate mirror-polishing process, characterized in that: the polishing pad has multiple open holes on the main surface that contacts the glass substrate; one open hole and another open hole adjacent thereto are separated by a partition; and of the side surfaces of said partition, an inclined section is provided on the side surface on the side of the other open hole and the inclined section has a minimum radius of curvature 20 - 100 µm. Said polishing pad provides, for example, a polishing pad with which polishing liquid components do not accumulate easily in the open holes while the mirror-finish processing rate is maintained.
Inventors:
KOMATSU TAKAFUMI (JP)
Application Number:
PCT/JP2012/005802
Publication Date:
April 04, 2013
Filing Date:
September 12, 2012
Export Citation:
Assignee:
KONICA MINOLTA ADVANCED LAYERS (JP)
KOMATSU TAKAFUMI (JP)
KOMATSU TAKAFUMI (JP)
International Classes:
B24B37/26; B24B1/00; B24B7/24; B24B37/00
Foreign References:
| JPH11333699A | 1999-12-07 | |||
| JP2005342820A | 2005-12-15 | |||
| JP2006261332A | 2006-09-28 | |||
| JP2005294661A | 2005-10-20 | |||
| JP2010045306A | 2010-02-25 | |||
| JP2003103470A | 2003-04-08 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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Claims: