Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING PAD HAVING EXCELLENT AIRTIGHTNESS
Document Type and Number:
WIPO Patent Application WO/2019/031789
Kind Code:
A1
Abstract:
An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent water leakage that may occur during a CMP process.

Inventors:
YUN SUNGHOON (KR)
SEO JANG WON (KR)
AHN JAEIN (KR)
YUN JONG WOOK (KR)
HEO HYE YOUNG (KR)
Application Number:
PCT/KR2018/008897
Publication Date:
February 14, 2019
Filing Date:
August 06, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SKC CO LTD (KR)
International Classes:
B24B37/20; B24B37/22; H01L21/306
Foreign References:
JP2003289056A2003-10-10
JP2009045694A2009-03-05
JP2004106174A2004-04-08
KR20150055047A2015-05-20
JP2008226911A2008-09-25
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
Download PDF: