Title:
POLISHING PAD HAVING EXCELLENT AIRTIGHTNESS
Document Type and Number:
WIPO Patent Application WO/2019/031789
Kind Code:
A1
Abstract:
An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent water leakage that may occur during a CMP process.
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Inventors:
YUN SUNGHOON (KR)
SEO JANG WON (KR)
AHN JAEIN (KR)
YUN JONG WOOK (KR)
HEO HYE YOUNG (KR)
SEO JANG WON (KR)
AHN JAEIN (KR)
YUN JONG WOOK (KR)
HEO HYE YOUNG (KR)
Application Number:
PCT/KR2018/008897
Publication Date:
February 14, 2019
Filing Date:
August 06, 2018
Export Citation:
Assignee:
SKC CO LTD (KR)
International Classes:
B24B37/20; B24B37/22; H01L21/306
Foreign References:
JP2003289056A | 2003-10-10 | |||
JP2009045694A | 2009-03-05 | |||
JP2004106174A | 2004-04-08 | |||
KR20150055047A | 2015-05-20 | |||
JP2008226911A | 2008-09-25 |
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
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