POLISHING PAD HAVING PATTERN STRUCTURE FORMED ON POLISHING SURFACE, POLISHING DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING POLISHING PAD

Title:

POLISHING PAD HAVING PATTERN STRUCTURE FORMED ON POLISHING SURFACE, POLISHING DEVICE INCLUDING SAME, AND METHOD FOR MANUFACTURING POLISHING PAD

Document Type and Number:

WIPO Patent Application WO/2020/242110

Kind Code:

A1

Abstract:

Provided are a polishing pad having an improved removal rate, a polishing device including same so as to have an improved removal rate, and a method for manufacturing the polishing pad having an improved removal rate. The polishing pad comprises a support layer and a pattern layer, which is disposed on one surface of the support layer, has a plurality of protruding patterns spaced from each other on the support layer, and has a rigidity greater than the rigidity of the support layer.

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Inventors:

KIM HYOUNG JAE (KR)
LEE TAE KYUNG (KR)
KIM DO YEON (KR)
KANG PIL SIK (KR)

Application Number:

PCT/KR2020/006523

Publication Date:

December 03, 2020

Filing Date:

May 19, 2020

Export Citation:

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Assignee:

KOREA INST IND TECH (KR)

International Classes:

B24B37/26; B24B37/22; H01L21/67

Foreign References:

KR20150032576A	2015-03-26
KR20030068576A	2003-08-21
KR20040070767A	2004-08-11
US7238093B1	2007-07-03
JP2001150332A	2001-06-05

Attorney, Agent or Firm:

KIM, Hyun Jae (KR)

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