POLISHING PAD, MANUFACTURING METHOD THEREFOR, AND POLISHING METHOD

Title:

POLISHING PAD, MANUFACTURING METHOD THEREFOR, AND POLISHING METHOD

Document Type and Number:

WIPO Patent Application WO/2010/150766

Kind Code:

A1

Abstract:

Provided is a polishing pad which is capable of improving the affinity to a polishing liquid and achieving the stabilization of the polishing performance. The polishing pad (10) is provided with a urethane sheet (2). The urethane sheet (2) has a polishing surface (P) to polish an object to be polished. The urethane sheet (2) is formed by a dry molding and is formed by slicing a urethane foam which is obtained by reacting and curing a liquid mixture in which isocyanate group-containing compound, water, a foam control agent, and polyamine compound are mixed. A foam (3) is dispersed in the urethane sheet (2) in a substantially uniform manner. Pores (4), which are opened parts of the foam (3), are formed on the polishing surface (P). In the urethane sheet (2), parts of the foam (3) formed adjacently to each other communicate through connection holes (9) which are formed at a rate of 800 connection holes/cm2 or more when viewed from the polishing surface (P) side. The polishing liquid moves through the connection holes (9) and the foam (3).

Inventors:

ITOYAMA KOHKI (JP)
TAKAHASHI DAISUKE (JP)
UENO JUNICHI (JP)
KOBAYASHI SYUICHI (JP)

Application Number:

PCT/JP2010/060521

Publication Date:

December 29, 2010

Filing Date:

June 22, 2010

Export Citation:

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Assignee:

FUJIBO HOLDINGS INC (JP)
SHINETSU HANDOTAI KK (JP)
ITOYAMA KOHKI (JP)
TAKAHASHI DAISUKE (JP)
UENO JUNICHI (JP)
KOBAYASHI SYUICHI (JP)

International Classes:

B24B37/24; H01L21/304

Foreign References:

JP2009125894A	2009-06-11
JP2005123232A	2005-05-12
JP2009101504A	2009-05-14
JP2003128910A	2003-05-08
JP2007276061A	2007-10-25

Other References: