Title:
POLISHING PAD, MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/118505
Kind Code:
A1
Abstract:
Disclosed is a polishing pad that can reduce tiny undulations on the surface of an object to be polished. Also disclosed are a method for manufacturing said polishing pad and a method for manufacturing a semiconductor device. The disclosed polishing pad has a polishing layer comprising a thermoset polyurethane foam that contains, as basic ingredients, an isocyanate component and active-hydrogen-containing compounds. Said active-hydrogen-containing compounds include a polyol compound with at least two functional groups and a mono-ol compound with one functional group.
Inventors:
DOURA, Masato (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
堂浦 真人 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 〒5508661, JP)
堂浦 真人 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 東洋ゴム工業株式会社内 Osaka, 〒5508661, JP)
Application Number:
JP2011/056455
Publication Date:
September 29, 2011
Filing Date:
March 17, 2011
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO., LTD. (17-18, Edobori 1-chomeNishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 Osaka, 〒5508661, JP)
DOURA, Masato (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
東洋ゴム工業株式会社 (〒61 大阪府大阪市西区江戸堀１丁目１７番１８号 Osaka, 〒5508661, JP)
DOURA, Masato (17-18,Edobori 1-chome,Nishi-ku,Osaka-sh, Osaka 61, 〒5508661, JP)
International Classes:
B24B37/00; C08G18/30; H01L21/304; C08G101/00
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (SHIN-OSAKA MT Bldg. 1, 13-9 Nishinakajima 5-chome,Yodogawa-ku, Osaka-shi, Osaka 11, 〒5320011, JP)
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Claims: