Title:
POLISHING PAD, MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/118505
Kind Code:
A1
Abstract:
Disclosed is a polishing pad that can reduce tiny undulations on the surface of an object to be polished. Also disclosed are a method for manufacturing said polishing pad and a method for manufacturing a semiconductor device. The disclosed polishing pad has a polishing layer comprising a thermoset polyurethane foam that contains, as basic ingredients, an isocyanate component and active-hydrogen-containing compounds. Said active-hydrogen-containing compounds include a polyol compound with at least two functional groups and a mono-ol compound with one functional group.
Inventors:
DOURA MASATO (JP)
ISHIZAKA NOBUYOSHI (JP)
ISHIZAKA NOBUYOSHI (JP)
Application Number:
PCT/JP2011/056455
Publication Date:
September 29, 2011
Filing Date:
March 17, 2011
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO (JP)
DOURA MASATO (JP)
ISHIZAKA NOBUYOSHI (JP)
DOURA MASATO (JP)
ISHIZAKA NOBUYOSHI (JP)
International Classes:
B24B37/24; C08G18/30; H01L21/304; C08G101/00
Foreign References:
| JP2010058220A | 2010-03-18 | |||
| JP2010064153A | 2010-03-25 | |||
| JP2006334745A | 2006-12-14 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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