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Patent Searching and Data


Title:
POLISHING PAD, MANUFACTURING METHOD THEREOF, AND METHOD FOR MANUFACTURING POLISHED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2018/186292
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a polishing pad capable of maintaining a stable polishing rate due to having a proper disintegration property; a manufacturing method thereof; and a method for manufacturing a polished product by using the polishing pad. According to the present invention, the polishing pad 10 is provided with a substrate 12, and a resin part 11 disposed on the substrate, wherein the resin part has a rosin-based compound and fixed abrasive particles 13 contributing to polishing of a material to be polished.

Inventors:
NAKASE KEISUKE (JP)
Application Number:
PCT/JP2018/013594
Publication Date:
October 11, 2018
Filing Date:
March 30, 2018
Export Citation:
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Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24D3/28; H01L21/304
Foreign References:
JP2016198878A2016-12-01
JP2009152646A2009-07-09
JP2013208687A2013-10-10
JP2009209320A2009-09-17
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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