Title:
POLISHING PAD, MANUFACTURING METHOD THEREOF, AND METHOD FOR MANUFACTURING POLISHED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2018/186292
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a polishing pad capable of maintaining a stable polishing rate due to having a proper disintegration property; a manufacturing method thereof; and a method for manufacturing a polished product by using the polishing pad. According to the present invention, the polishing pad 10 is provided with a substrate 12, and a resin part 11 disposed on the substrate, wherein the resin part has a rosin-based compound and fixed abrasive particles 13 contributing to polishing of a material to be polished.
Inventors:
NAKASE KEISUKE (JP)
Application Number:
PCT/JP2018/013594
Publication Date:
October 11, 2018
Filing Date:
March 30, 2018
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24D3/28; H01L21/304
Foreign References:
JP2016198878A | 2016-12-01 | |||
JP2009152646A | 2009-07-09 | |||
JP2013208687A | 2013-10-10 | |||
JP2009209320A | 2009-09-17 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF:
Previous Patent: ROBOT AND METHOD FOR OPERATING SAME
Next Patent: METHOD FOR PRODUCING GAS DIFFUSION ELECTRODE SUBSTRATE, AND FUEL CELL
Next Patent: METHOD FOR PRODUCING GAS DIFFUSION ELECTRODE SUBSTRATE, AND FUEL CELL