Title:
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2022/201254
Kind Code:
A1
Abstract:
This polishing pad comprises a polyurethane sheet as a polishing layer, the polyurethane sheet being such that the ratio (E'B40/E'T40) of the 40°C storage elastic modulus E'B40 in a dynamic viscoelasticity measurement performed under bending mode conditions at a frequency of 1.6 Hz to the 40°C storage elastic modulus E'T40 in a dynamic viscoelasticity measurement performed under tension mode conditions at a frequency of 1.6 Hz is 0.60-1.60.
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Inventors:
TATENO TEPPEI (JP)
MATSUOKA RYUMA (JP)
KURIHARA HIROSHI (JP)
YAMAGUCHI SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
MATSUOKA RYUMA (JP)
KURIHARA HIROSHI (JP)
YAMAGUCHI SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2021/011762
Publication Date:
September 29, 2022
Filing Date:
March 22, 2021
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/24; H01L21/304
Foreign References:
| JP2019177430A | 2019-10-17 | |||
| JP2010230911A | 2010-10-14 | |||
| JP2020055040A | 2020-04-09 | |||
| JP2020104235A | 2020-07-09 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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