Title:
POLISHING PAD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/110258
Kind Code:
A1
Abstract:
Provided is a polishing pad the size of which can be set freely and which is easily attachable to a polishing device. A polishing pad (1) comprises a plurality of pad pieces (3a–3f), a plurality of joining sections, and a plurality of groove sections (2). Each of the pad pieces (3a–3f) has a planar shape obtained by dividing the polishing pad (1) into a plurality of regions, and the combination of the pad pieces (3a–3f) as a whole forms a polishing layer. The joining sections are disposed along joining boundaries (B) of the pad pieces (3a–3f) and join end surfaces of neighboring pad pieces to sections which can't be integrated. The plurality of groove sections (2) are recessed in stripe shapes in the surface of the polishing layer, and at least a portion thereof correspond positionally to the joining boundaries (B) (joining sections).
Inventors:
OISHI KUNIHARU (JP)
UNNO TATSUHIRO (JP)
UNNO TATSUHIRO (JP)
Application Number:
PCT/JP2018/043989
Publication Date:
June 04, 2020
Filing Date:
November 29, 2018
Export Citation:
Assignee:
DAIKI KK (JP)
International Classes:
B24B37/24; B24B37/26; B24D11/06; H01L21/304
Foreign References:
| JP2003115468A | 2003-04-18 | |||
| JP2015139851A | 2015-08-03 | |||
| JP2918883B1 | 1999-07-12 | |||
| JP2001274120A | 2001-10-05 | |||
| JP2005294412A | 2005-10-20 | |||
| JP2013533125A | 2013-08-22 | |||
| JP2011212807A | 2011-10-27 |
Attorney, Agent or Firm:
KUMEGAWA Masamitsu (JP)
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