Title:
POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND WAFER POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/176315
Kind Code:
A1
Abstract:
Provided is a polishing pad that makes it easier to manage polishing liquid, enables omission or simplification of a wafer cleaning step after polishing, makes treatment of the polishing liquid less cumbersome after polishing, and enables achieving high polishing rate and high surface quality of wafers after polishing. A polishing pad 10 according to the present invention comprises: a base material 12 which is composed of a base material resin and has a plurality of pores 14 formed therein; and abrasive particles 16 which are retained in the base material 12 or in the pores 14. When an arbitrarily defined pore is defined as a specific pore, and, in said specific pore, when the shortest inner diameter is defined as a short diameter and the longest inner diameter is defined as a long diameter, the pore-related area, which is obtained by multiplying the short diameter, the long diameter, the circular constant, and 1/4, has an average value of at least 87.7 μm2. The abrasive particles 16 are silica particles having a specific surface area of 8.9-10.5 m2/g.
Inventors:
ITO RYOMA (JP)
KISHIMOTO MASATOSHI (JP)
KISHIMOTO MASATOSHI (JP)
Application Number:
PCT/JP2023/005902
Publication Date:
September 21, 2023
Filing Date:
February 20, 2023
Export Citation:
Assignee:
NORITAKE CO LTD (JP)
International Classes:
B24D3/32; B24B37/24; B24D3/00; B24D11/00; H01L21/304
Domestic Patent References:
| WO2018012468A1 | 2018-01-18 |
Foreign References:
| JP2006519115A | 2006-08-24 | |||
| JP2000063630A | 2000-02-29 |
Attorney, Agent or Firm:
PATENA CORPORATION (JP)
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