POLISHING PAD AND METHOD FOR MANUFACTURING THE POLISHING PAD

WIPO Patent Application WO/2010/016486

A1

Disclosed is a polishing pad that is less likely to cause scratching and has excellent flattening properties and polishing stability. One aspect of the present invention provides a polishing pad characterized by comprising an ultrafine fiber interlaced body formed of ultrafine fibers having an average fineness of 0.01 to 0.8 dtex and a polymeric elastic body, the polymeric elastic body having a glass transition temperature of not more than -10°C, a storage elastic modulus of 90 to 900 MPa at 23 to 50°C, and a water absorption of 0.2 to 5% by mass as measured after water absorption saturation at 50°C.

NAKAYAMA, Kimio (7471, Tamashima otoshima, Kurashiki-sh, Okayama 50, 〒7138550, JP)
中山　公男 (〒50 岡山県倉敷市玉島乙島７４７１番地　株式会社クラレ内 Okayama, 〒7138550, JP)
TAKAOKA, Nobuo (7471, Tamashima otoshima, Kurashiki-sh, Okayama 50, 〒7138550, JP)
高岡　信夫 (〒50 岡山県倉敷市玉島乙島７４７１番地　株式会社クラレ内 Okayama, 〒7138550, JP)

JP2009/063802

February 11, 2010

August 04, 2009

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KURARAY CO., LTD. (1621, Sakazu Kurashiki-sh, Okayama 22, 〒7108622, JP)
株式会社クラレ (〒22 岡山県倉敷市酒津１６２１番地 Okayama, 〒7108622, JP)
NAKAYAMA, Kimio (7471, Tamashima otoshima, Kurashiki-sh, Okayama 50, 〒7138550, JP)
中山　公男 (〒50 岡山県倉敷市玉島乙島７４７１番地　株式会社クラレ内 Okayama, 〒7138550, JP)
TAKAOKA, Nobuo (7471, Tamashima otoshima, Kurashiki-sh, Okayama 50, 〒7138550, JP)

B24B37/00; D04H3/016; D04H3/10; H01L21/304

KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)

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