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Patent Searching and Data


Title:
POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/255744
Kind Code:
A1
Abstract:
A polishing pad that includes a polishing layer having a polishing surface, the polishing pad being such that: the polishing surface comprises a deep-groove region having a first pattern formed from deep grooves or holes having a depth of 0.3 mm or greater, and a land region that is the region other than the deep-groove region; and the land region has shallow recesses having a depth of 0.01-0.1 mm, the shallow recesses having a second pattern, and a plurality of island-form land parts surrounded by the shallow recesses, the land parts being such that the maximum horizontal distance therebetween is 8 mm or less.

Inventors:
KATO MITSURU (JP)
KIKUCHI HIROFUMI (JP)
OKAMOTO CHIHIRO (JP)
KATO SHINYA (JP)
Application Number:
JP2020/022213
Publication Date:
December 24, 2020
Filing Date:
June 04, 2020
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
B24B37/24; B24B37/26; B24B53/017; H01L21/304
Attorney, Agent or Firm:
EGAWA Masaru et al. (JP)
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