POLISHING PAD AND METHOD FOR PRODUCING POLISHING PAD

WIPO Patent Application WO/2016/047535

A1

The purpose of the present invention is to provide a polishing pad which is able to achieve a good balance between reduction of the processing time and prevention of scratches on a polished object. The present invention is a polishing pad comprising a base and a polishing layer laminated on the front surface of the base, and this polishing pad is characterized in that: the polishing layer comprises a resin binder and abrasive grains dispersed in the binder; the abrasive grains have an average grain diameter of from 2 μm to 45 μm (inclusive); the binder has a durometer D hardness of from 60 to 88 (inclusive); the polishing layer has a plurality of projections in the surface; the projections have an average area of from 0.5 mm2 to 13 mm2 (inclusive); and the area occupancy of the plurality of projections in the whole polishing layer is from 5% to 40% (inclusive). It is preferable that the abrasive grains are diamond abrasive grains. It is preferable that the composition that constitutes the binder is mainly composed of a thermosetting epoxy resin. It is preferable that the plurality of projections are in a regularly arranged block pattern. It is preferable that an adhesive layer is provided on the back surface of the base.

MUKAI FUMIHIRO (JP)
TAURA TOSHIKAZU (JP)
TAKAGI DAISUKE (JP)
SUZUKI SHINJI (JP)

PCT/JP2015/076379

March 31, 2016

September 17, 2015

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BANDO CHEMICAL IND (JP)

B24D11/00; B24D3/00; B24D3/28

WO2011058969A1	2011-05-19
WO2014044090A1	2014-03-27

JP2009072832A	2009-04-09
JPH03256676A	1991-11-15
JP2007190613A	2007-08-02
JP2011031361A	2011-02-17

AMANO KAZUNORI (JP)
Kazuki Amano (JP)

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