Title:
POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/217278
Kind Code:
A1
Abstract:
The present invention provides a polishing pad which is a cured foam of a urethane resin composition containing (i) a base material that contains a urethane prepolymer (A) having an isocyanate group, said urethane prepolymer (A) being a reaction product of a polyol (a1) containing a polysiloxane compound represented by general formula (1) and a polyisocyanate (a2) and (ii) a curing agent, and which is characterized in that the ratio of the polysiloxane compound in the starting material for the urethane prepolymer (A) is 1% by mass or less. This polishing pad has excellent polishing rate and enables the achievement of a polished article which has less scratches in the surface of a polished material after polishing, thereby having excellent smoothness.
Inventors:
ODA YOSHIYUKI (JP)
SHIBA YUICHIRO (JP)
SHIBA YUICHIRO (JP)
Application Number:
PCT/JP2017/020926
Publication Date:
December 21, 2017
Filing Date:
June 06, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B24B37/24; C08G18/10; C08G18/40; C08G18/61; C08J5/14; H01L21/304; C08G101/00
Foreign References:
| JP2013052492A | 2013-03-21 | |||
| JP2013086217A | 2013-05-13 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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