POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD

Title:

POLISHING PAD, POLISHING METHOD USING POLISHING PAD, METHOD FOR USING SAID POLISHING PAD

Document Type and Number:

WIPO Patent Application WO/2017/072919

Kind Code:

A1

Abstract:

Provided is a polishing pad having a resin foam article composed of a thermoplastic resin with excellent re-polishing characteristics, the polishing pad being capable of eliminating or dramatically shortening pre-polishing time and realizing simple polishing, and being capable of highly reliable and efficient polishing by continuous polishing at an excellent polishing speed from an initial stage. The polishing pad (1, 2) is composed of a highly rigid thermoplastic hard resin foam article having a three-dimensional cell structure partitioned by cell walls so as to have a plurality of cells and partitions in which these cells are mutually independent. The polishing pad has a structure in which the tensile strength is 50-90 MPa, bending strength is 90-140 MPa, the tensile modulus of elasticity and the flexural elastic modulus are both 2400 MPa or greater, the average cell diameter is 4-50 μm, the average cell wall thickness is 1-5 μm, and the ratio of the average cell diameter to the average cell wall thickness is in a range of 4-10, the values being the mechanical characteristics of the wall section of the cell walls as expressed by the mechanical characteristics of the resin sheet material prior to foaming.

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Inventors:

YOKOTA NOBUTOSHI (JP)
YAMAMOTO SYUNJI (JP)
KUBOTA TETSUJI (JP)
TODA SADAYUKI (JP)
MASUDA MITSUO (JP)

Application Number:

PCT/JP2015/080598

Publication Date:

May 04, 2017

Filing Date:

October 29, 2015

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)

International Classes:

B24B37/24

Foreign References:

JP2005532176A	2005-10-27
JP2011067945A	2011-04-07
JP2009113196A	2009-05-28
JP2000232082A	2000-08-22
JP2001105300A	2001-04-17

Attorney, Agent or Firm:

EINSEL Felix-Reinhard et al. (JP)

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