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Patent Searching and Data


Title:
POLISHING PAD AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/021428
Kind Code:
A1
Abstract:
Provided is a polishing pad having a polishing surface which has a zeta potential of +0.1 mV or higher at pH 10.0. Preferably, also provided is a polishing pad that comprises a polyurethane including a tertiary amine. More preferably, the polyurethane including a tertiary amine is a reaction product of a polyurethane reaction raw material that at least contains a chain elongation agent including a tertiary amine. Also provided is a polishing method using either one of the polishing pads, wherein polishing is conducted while an alkaline polishing slurry is being supplied.

Inventors:
TAKEGOSHI Minori
KATO Mitsuru
OKAMOTO Chihiro
KATO Shinya
Application Number:
JP2017/027095
Publication Date:
February 01, 2018
Filing Date:
July 26, 2017
Export Citation:
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Assignee:
KURARAY CO., LTD. (1621, Sakazu Kurashiki-sh, Okayama 01, 〒7100801, JP)
International Classes:
H01L21/304; B24B37/24; C08J5/14
Attorney, Agent or Firm:
EGAWA Masaru et al. (EGAWA PATENT ATTORNEYS OFFICE, 2F Sun BUILDING 7-4-18, Fuchucho, Izumi-sh, Osaka 71, 〒5940071, JP)
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