Title:
POLISHING PAD AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/021428
Kind Code:
A1
Abstract:
Provided is a polishing pad having a polishing surface which has a zeta potential of +0.1 mV or higher at pH 10.0. Preferably, also provided is a polishing pad that comprises a polyurethane including a tertiary amine. More preferably, the polyurethane including a tertiary amine is a reaction product of a polyurethane reaction raw material that at least contains a chain elongation agent including a tertiary amine. Also provided is a polishing method using either one of the polishing pads, wherein polishing is conducted while an alkaline polishing slurry is being supplied.
Inventors:
TAKEGOSHI MINORI
KATO MITSURU
OKAMOTO CHIHIRO
KATO SHINYA
KATO MITSURU
OKAMOTO CHIHIRO
KATO SHINYA
Application Number:
PCT/JP2017/027095
Publication Date:
February 01, 2018
Filing Date:
July 26, 2017
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
H01L21/304; B24B37/24; C08J5/14
Domestic Patent References:
| WO2008029725A1 | 2008-03-13 |
Foreign References:
| US20150183081A1 | 2015-07-02 | |||
| JP2004297061A | 2004-10-21 | |||
| JP2005294661A | 2005-10-20 | |||
| JP2013018056A | 2013-01-31 | |||
| JP2005294661A | 2005-10-20 |
Other References:
See also references of EP 3493244A4
Attorney, Agent or Firm:
EGAWA Masaru et al. (JP)
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