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Patent Searching and Data


Title:
POLISHING PAD AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/013935
Kind Code:
A1
Abstract:
Provided is a polishing pad capable, when polishing an object to be polished that has a protrusion and/or recess on the surface, of adequately polishing the parts near the protrusion or the inner surface of the recess on the surface of the object being polished. The polishing pad has a raised nap section (1) in which multiple fibers (12) of at least 2 mm length are raised on the surface of a base (11), and the mass of the fibers (12) is at least 250 g/m2. Said polishing pad is used for polishing an object (2) to be polished that contains metal, alloy or metal oxide material and has a protrusion (21) and/or a recess (22) on the surface.

Inventors:
MORINAGA HITOSHI (JP)
TAMAI KAZUSEI (JP)
TAHARA MUNEAKI (JP)
ASAI MAIKO (JP)
ITO YUUICHI (JP)
Application Number:
PCT/JP2016/064775
Publication Date:
January 26, 2017
Filing Date:
May 18, 2016
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
B24B37/24; B24B37/00
Foreign References:
JP2009196042A2009-09-03
JP2008055575A2008-03-13
JP2003165045A2003-06-10
JP2001105296A2001-04-17
JP2006326754A2006-12-07
JP2013043222A2013-03-04
Other References:
See also references of EP 3326751A4
Attorney, Agent or Firm:
MORI Tetsuya et al. (JP)
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