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Patent Searching and Data


Title:
POLISHING PAD, POLISHING PLATE HOLE COVER, POLISHING APPARATUS, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/021426
Kind Code:
A1
Abstract:
A windowed polishing pad used for forming a flat surface on a glass, a semiconductor, a dielectric/metal composite, an integrated circuit and so on, wherein less scratches are given to the surface of a substrate and the polishing condition can be optically measured well during the polishing. The polishing pad has a polishing layer and a transparent window member for the optical measurement of the polishing condition, which is provided in an opening formed in a part of the polishing layer. The indentation of the transparent window member when a certain load is applied to almost entire upper surface of the window member is larger than the indentation of the polishing layer when the same load is applied to a part of the upper surface of the polishing layer having an area equal to that of the window member.

Inventors:
SHIRO KUNIYASU (JP)
KOBAYASHI TSUTOMU (JP)
HASHISAKA KAZUHIKO (JP)
Application Number:
PCT/JP2003/010749
Publication Date:
March 11, 2004
Filing Date:
August 26, 2003
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
SHIRO KUNIYASU (JP)
KOBAYASHI TSUTOMU (JP)
HASHISAKA KAZUHIKO (JP)
International Classes:
B24B37/20; B24D13/14; (IPC1-7): H01L21/304
Domestic Patent References:
WO2002102546A12002-12-27
Foreign References:
JPH097985A1997-01-10
JP2001162520A2001-06-19
Other References:
See also references of EP 1475827A4
Attorney, Agent or Firm:
Iwami, Tomonori c/o Intellectual Property Department (TORAY INDUSTRIES INC., 1-1, Sonoyama 1-chom, Otsu-shi Shiga, JP)
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