Title:
POLISHING PAD, PROCESS FOR PRODUCING THE SAME, AND METHOD OF POLISHING
Document Type and Number:
WIPO Patent Application WO/2003/058698
Kind Code:
A1
Abstract:
A polishing pad for polishing the surface of a wafer for semiconductor integrated-circuit formation thereon, which has a high polishing rate, attains evenness of polishing, and has a long life. Preferably, the polishing pad comprises a nonwoven fabric (base) and a non-porous photocured resin filling the spaces among fibers of the nonwoven fabric. It is obtained by: impregnating the base with a photosensitive resin composition comprising at least one member selected from the group consisting of hydrophilic photopolymerizable polymers or oligomers and hydrophilic photopolymerizable monomers; and then photocuring the composition.
Inventors:
FURUKAWA SHOICHI (JP)
NAKAMURA ATSUSHI (JP)
NAKAMURA ATSUSHI (JP)
Application Number:
PCT/JP2002/013709
Publication Date:
July 17, 2003
Filing Date:
December 26, 2002
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
FURUKAWA SHOICHI (JP)
NAKAMURA ATSUSHI (JP)
FURUKAWA SHOICHI (JP)
NAKAMURA ATSUSHI (JP)
International Classes:
B24B37/24; B24B37/26; B24D3/28; B24D11/00; B24D13/14; (IPC1-7): H01L21/304
Foreign References:
| JP2000301449A | 2000-10-31 | |||
| EP0451944A2 | 1991-10-16 | |||
| JPH1190836A | 1999-04-06 |
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo, JP)
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